| 4-layer PCB with Immersion Gold 2007-10-16 |
4-layer PCB
Base material: FR4
Immersion gold |
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| Eight-layer PCB with FR-4 2007-10-16 |
Eight-layer PCB
Base material: FR4, 1.6mm
Board dimensions: 153 x 184mm
Surface treatment: immersion gold |
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| Six-layer Flex Circuit PCB 2007-10-16 |
Six-layer flex circuit
One mil polyamide
One ounce copper
One mil cover lay
Separate layers
Surface finishing: immersion gold
RoHS compliance |
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| Four-layer Rigid-flex PCB with RoHS Compliance 2007-10-16 |
Four-layer rigid-flex circuit
1 mil polyimide
1 oz copper
1 mil coverlay
Aluminum foil
Immersion gold
RoHS compliance |
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| Four-layer FPC 2007-10-16 |
Four-layer FPC
Base material: polyimide
Surfact treatment: immersion gold |
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| Double-sided FPC 2007-10-16 |
Double-sided FPC (air-gap structure)
Board dimensions: 95 x 32mm
Base material: polyimide
Surface treatment: gold plating
Polyimide stiffeners on 2 places |
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| RoHS-compliant Double-sided PCB 2007-10-16 |
Layer count: two
Base material: FR4
Board thickness: 1.6mm
Surface finishing: immersion gold
RoHS-compliant constructure
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| Aluminum-based PCB 2007-10-16 |
Layer count: two
Substrate: aluminum-based copper-clad laminate
Board thickness: 1.5mm
Silkscreen: white and LPI
Surface finishes: immersion gold, HAL and OSP
Lead time: around two weeks |
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